News & Events

WINSYSTEMS Releases New Ruggedized Industrial SBCs Built on Intel® Atom™ E3800 CPU in EPIC Form Factor

December 1, 2016
EPX-C414

Upgraded boards with two miniPCIe sockets support high-speed I/O expansion, addition of bolt-on mSATA SSD drive, and compatibility with both legacy and leading-edge operating systems ARLINGTON, Texas – December 1, 2016 – WINSYSTEMS, a leading designer and manufacturer of industrial embedded computer modules, today unveiled its new series of shock- and vibration-tested single board computers… Read More »

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WINSYSTEMS Debuts Single Board Computers Built on Intel Atom E3900 Series CPU in PC/104 Form Factor

November 10, 2016
PX1-C415 SBC

First PCIe®/104 OneBank® E3900-based product for industrial operations boosts processing performance, offers dense mix of I/O interfaces, connectivity and expansion options in a small size ARLINGTON, Texas – November 10, 2016 – WINSYSTEMS today announced a new line of single board computers with dual Ethernet that feature the Intel® Atom™ Processor E3900 Series for high-performance… Read More »

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WINSYSTEMS Introduces Industrial Single Board Computers Featuring Intel® E3800 Processors in EBX Form Factor

November 1, 2016

Fanless -40° to +85°C Operation and PC/104-Plus Expansion for Rugged Applications Complement Gains in Performance and Efficiency ARLINGTON, Texas – November 1, 2016 – WINSYSTEMS, a leading designer and manufacturer of industrial embedded computer modules, has introduced a new line of Intel® Atom™ E3800-based single board computers designed to operate in temperatures ranging from -40°C… Read More »

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New Hire Announcement – Sales Engineer

October 30, 2015

Q3, 2015 – WINSYSTEMS is pleased to announce and welcome Dustin Wilson as a new addition to the Sales and Marketing department. Dustin will be the Sales Engineer representing the central United States. He will be responsible for assisting customers with product selection, implementation and serve as the team’s technical support expert. Originally from Arlington,… Read More »

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Bob Burckle Awarded ECE Alumnus of 2015

October 23, 2015

Receives prestigious University of Louisville – JB Speed School Award for Achievement and Service October 23, 2015, Louisville, KY – Today, Robert A. (Bob) Burckle, Vice-President of WINSYSTEMS, Inc. received the 2015 Professional Award in Engineering from the Electrical and Computer Engineering (ECE) Department of the University of Louisville, JB Speed School. This is the… Read More »

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WINSYSTEMS®, Inc. Joins ARM™ Connected Community®

July 18, 2013

July 18, 2013; Arlington, TEXAS, USA – WINSYSTEMS, a leading designer and manufacturer of rugged, extended temperature embedded computer modules, today announced it is a new member in the ARM Connected Community, the industry’s largest ecosystem of ARM -based technology, products and services. Membership of the ARM Connected Community underlines WINSYSTEMS’ commitment to provide

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Multicore ARM® SBCs Boast High Performance Graphics with Industrial I/O Mix

April 23, 2013

SBC35-C398Q Multicore ARM® Single Board Computers Boast High Performance Graphics with Industrial I/O Mix -40°C to +85°C SBCs Provide Efficient Processing and Expansion for Embedded Applications April 23, 2013; Design West Booth 1438, San Jose, CA, USA – WINSYSTEMS, a leading designer and manufacturer of rugged, extended temperature embedded computer modules, introduces a line of… Read More »

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PC/104-Plus Two-Channel Gigabit Ethernet Card Supports Power over Ethernet (PoE)

March 27, 2013
PC:104-Plus Two-Channel Gigabit Ethernet Card

PPM-GIGE-2-POE PC/104-Plus Two-Channel Gigabit Ethernet Card Supports Power over Ethernet (PoE) -40°C to +85°C Module Provides Networking and Power for Embedded Applications March 27, 2013 – WINSYSTEMS, a leading designer and manufacturer of rugged, extended temperature embedded computer modules, introduces the PPM-GIGE-2-PoE. This PC/104-Plus module integrates two independent Gigabit Ethernet ports with Power Sourcing Equipment… Read More »

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