We’ve posted a number of articles lately about security in general and the Trusted Platform Module (TPM) specifically. Here are a few:
The TPM standard defines a hardware root of trust, which is widely accepted as being more secure than a software approach and is generally employed in conjunction with software, thereby enabling those software-based features.
Due to the heightened concern around security and root of trust, WINSYSTEMS has made the decision to add a TPM 2.0 option to most of its new CPU board designs. For example, the WINSYSTEMS ITX-N-3900 and SBC35-427 SBCs feature the Intel E3900 series SoC microprocessor (formerly the Apollo Lake-I) with a soldered down TPM 2.0, which establishes the root of trust for hardware deployment.
It’s well known that security starts with the hardware root of trust. And pairing with the E3900 series SoCs provides a powerful yet secure starting point for small form-factor designs that are Size Weight and Power (SWaP) optimized for applications in the industrial and Mil/COTS arenas.
The SBC35-427 boasts a combination of off-the-shelf functionality with multiple expansion and configuration options and very low profile, making it a great fit for industrial IoT installations such as transportation where SWaP is important for retrofitting vehicles, particularly where fanless operation is needed.
The ITX-N-3900 is designed for long-term availability, hence the need for an extra layer of protection. It consumes less than 12 W, making it suitable for fanless applications, while still operating in industrial temperatures ranges, from -40ºC to +85ºC with a footprint of just 240 mm2.
Note that TPM 2.0 isn’t just for X86-based designs. WINSYTEMS employs the solution on its latest Arm-based offering, the ITX-P-C444. This SBC fits an industrial Pico-ITX form factor, and is designed with NXP’s i.MX8M applications processor. Other features include dual Ethernet, industrial I/O, and a host of expansion options. The tiny Pico-ITX form factor is just 100mm x 72mm providing full -40 to +85C with the heat spreader provided.
As we have come to learn, you can pack in whatever features you desire. But if your system isn’t secure, it doesn’t matter. Look for SBCs that start with TPM 2.0 and provide the small form factor design to meet your SWaP requirements.