USA-DESIGNED AND MANFACTURED EMBEDDED COM SOLUTIONS
Across diverse industries, today’s system designers face daunting imperatives:
• Accelerate product development.
• Design and enable increasingly sophisticated, interconnected applications.
• Extend the life cycles of existing designs to delay obsolescence.
• Reduce the risks and costs associated with new product development.
• Ensure embedded computing systems are secure and supply chains reliable.
Meeting these challenges requires highly reliable embedded computing solutions that incorporate extensive functionality yet can be modified to fit any application or be easily upgraded. These capabilities and others have been the driving factors in the explosive growth worldwide of Computer-on-Module (COM) solutions.
The computer-on-module concept
PROVEN AND FLEXIBLE
COM technology has been around in various forms for decades and consists of a mezzanine approach with CPU, memory and basic I/O interfaces on a module that mounts to a single carrier board or a stack of boards to complete the I/O and system requirements. The approach allows the most complicated part of the design to be separated from the unique I/O requirements of different carrier board solutions. PC/104 is often considered one of the original COM module approaches. Not only does PC/104 provide an ecosystem of CPU and I/O vendors, many OEMs used the standardized bus and mounting to design unique carrier cards using off-the-shelf CPU modules available from multiple vendors.
INFINITE OPTIONS – CLEAR ADVANTAGES
The proven COM module computing solution is a practical way to shorten design cycles, provide performance scalability, minimize single-source risks, and extend the service life of products. This approach allows for prototypes to be developed and tested with much less expense than designing and manufacturing CPU-based designs.
AN EXTENSION OF WINSYSTEMS’ EMBEDDED COMPUTING EXPERTISE
For 38 years, product designers who support critical infrastructure and applications have turned to WINSYSTEMS for highly reliable embedded computing solutions that reduce their development risk and time to market. We are recognized as a leading innovator and provider of industrial embedded computing systems, notably industrial single board computers, rugged panel PCs, and I/O modules.
Few companies that focus on designing carrier boards possess the knowledge or resources to design CPUs. That’s why, for some time, customers have been asking WINSYSTEMS to produce USA-made COM modules to empower their product designs. In response to their evolving needs and increasing requests, we are delighted to introduce WINSYSTEMS’ newest product line of COM modules, which build on our nearly four decades of embedded CPU design expertise.
INTRODUCING WINSYSTEMS’ MADE-IN-USA COM EXPRESS MODULES
The industry standards adopted by manufacturers for COM modules are PC/104, COM Express®, SMARC, and Qseven. WINSYSTEMS is launching its new computer-on-module product line with COM Express-compatible modules. These are the modules most in demand by our clients because they deliver the performance needed for artificial intelligence (AI) and edge computing.
WINSYSTEMS’ debut COM module product is the COM Express® Type 10 Mini, one of the most commonly used pin-outs because of its small size and functionality. Future offerings will include COM Express® Type 6, and COM Express® Type 7 with higher-performance processors.
The continued growth of the Industrial Internet of Things (IIoT) is driving more computational power to edge computing platforms where COM modules with specialized carrier boards provide the connectivity and sensor inputs.
- Industrial Automation / IIoT / Edge Computing
- Machine Learning / AI
- Robotics / Drones
Unmanned Aerial Vehicles (UAVs)
Unmanned Maritime Vehicles (UMVs)
- Medical Diagnostics and Equipment
- Military / COTS
- Test & Measurement
Accelerated product development
Focus your time on the application-specific functions that will distinguish your product in the market. Attach a COM Express® module onto a custom-designed carrier board, and you will have all the computing and connection options needed to gain the competitive edge.
Simpler, more secure upgrades
WINSYSTEMS’ COM modules are USA-designed and -manufactured products, supporting dependable supply chain management. Most include TPM 2.0 on-module for improved security and easier upgrades to current embedded designs without modifying the carrier design.
Reduced development risk
COM modules offer proven performance and form/fit/function compatibility. Because WINSYTEMS has been providing custom carrier and embedded computing designs for years, we understand the complexities of BIOS customization and integration required to make OEM products successful.
Long-term product availability
WINSYSTEMS’ highly reliable embedded systems are designed for challenging operating environments, extended temperatures and long product life cycles.