Feature-packed SYS-427’s compact embedded SBC design harnesses the Intel E3900 processor; stands up to punishing thermal, shock and vibration demands with ruggedized packaging GRAND PRAIRIE, Texas – February 7, 2020 – Industrial embedded computing innovator WINSYSTEMS today announced its latest enclosed single board computer for extreme operating temperatures and environments. The SYS-427 is a… Read More »
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Move to new location effective September 23, 2019 opens doors to continued growth, additional manufacturing capabilities and greater efficiencies to better serve customers ARLINGTON, Texas – September 12, 2019 – Leading industrial embedded computer designer and manufacturer WINSYSTEMS today announced details of its fast-approaching move to larger and newly remodeled corporate headquarters and manufacturing… Read More »
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How does a world-class provider of rugged embedded computer systems prepare for its 37th year in business? By making major investments in its people and capabilities, accelerating the introduction of new products, and reintroducing itself with a brand-new visual identity that reflects its dynamic growth and industry leadership. WINSYSTEMS stands on nearly four decades of… Read More »
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High-reliability ITX-F-3800 industrial SBC delivers impressive performance, functionality and configuration flexibility for diverse applications and packaging solutions
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SYS-ITX-P-3800 embedded computing platform provides remarkably small rugged enclosure, dual Ethernet and proven fanless performance at operational temperatures of -20ºC to +70ºC ARLINGTON, Texas – November 14, 2018 – Embedded computing industry leader WINSYSTEMS today announced its first Pico-ITX Intel® Atom™ E3800 processor-based computing platform packaged in a compact-yet-rugged aluminum enclosure. Measuring just 5.71… Read More »
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Rugged ITX-P-3800 design packs fanless performance into miniscule form factor; embedded SBC offers industrial connectors and -20ºC to +70ºC operating temperature range
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ITX-N-3900 industrial SBC offers formidable processing power and future-ready versatility; incorporates latest TPM 2.0 technology and USB 3.1 host ports in a high-reliability package ARLINGTON, Texas – October 18, 2018 – Industrial embedded computer innovator WINSYSTEMS today introduced its next-generation computing platform in the Nano-ITX form factor. The ITX-N-3900 provides a complete system that can be… Read More »
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