The COMeT6-1100 is an industrial COM Express Type 6 Compact module with an Intel. 11th Gen Intel Core™ i3/i5/i7 Processor. This industrial module is designed and manufactured in the USA. The small form factor module is designed as a processor mezzanine that can be plugged onto a carrier board that contains user-specific I/O requirements.



Performance for Industrial IoT Applications

  • 11th Gen Intel Core i3/i5/i7 Processor, formally Tiger Lake-UP3
  • Up to 32GB LPDDR4 4266 MT/s System Memory, supporting IBECC
  • 12MB Cache for CoreTM i7, 8 MB for Core i5, 6MB for Core i3, 4 MB for Celeron


  • On-board Discrete TPM 2.0 Hardware Security

Rugged Design for Demanding Environments

  • -40ºC to +85ºC Operating Temperature Range
  • COM Express Type 6 Compact, Small Form Factor
Processor Options

Intel® Core™ i7-1185G7E

Intel® Core™ i5-1145G7E

Intel® Core™ i3-1115G4E

Intel® Celeron® 6305E

Intel® Core™ i7-1185GRE

Intel® Core™ i5-1145GRE

Intel. Core™ i3-1115GRE


AMI UEFI in Quad-SPI Flash with Intel. AMT support


Up to 32GB LPDDR4 4266 MT/s (2133MHz) System Memory

Commercial and Industrial memory options available (see ENVIRONMENTAL specifications)


2x SATA III (6 Gb/s)


Four independent video outputs

− 3x Digital Display Interface (DDI) to DisplayPort++ / HDMI / DVI

− 1x eDP (optional LVDS)

− 1x VGA


5x PCIe lanes configurable to 4 x1, 2 x2, 1 x4, 2 x1 + 1 x2, 1 x2 + 2 x1) and Lane 4 (x1 only)

4x USB 3.2 Gen 1, 8x USB 2.0

1x i226 2.5 Gb/s Ethernet RGMII

Intel HD Audio

2x UART with console redirection

4x GPI, 4x GPO (SDIO option for MicroSD socket)


Standard 12V Input, +/- 10%. CPU TDP = 28W max, software controllable to reduce to 15W or 12W TDP


Broad OS Support, including Windows10, Windows 11, Ubuntu, Red Hat, and other x86 operating systems

Custom configurable UEFI-based AMI BIOS

System Management Libraries and Tools


Commercial Temperature: 0ºC to +60ºC (32ºF to +140ºF)1

Industrial Temperature: -40ºC to +85ºC (-40ºF to +185ºF)1

CE Compliant

1 Requires thermal solution via heat spreader/heatsink and/or airflow


Dimensions – 3.75 in x 3.75 in (95 mm x 95 mm)

• Weight – TBD with heat spreader

• PC Board thickness 0.078 inches (2 mm)